The build envelope.
Assembly, fabrication, inspection, test, and component sourcing under one build plan. Assembly runs through our US partner facility; fabrication, inspection, and test routing are named in the quote before approval.
Talk through a program with usOperating summary
- Assembly
- Qualified US partner facility
- Inspection + test
- Defined in the build plan
- Fabrication
- US, India, Vietnam
- Turn time
- 5–7 days, quote to ship
- Layer count
- Up to 32 layers
- Placement
- 01005 · 0.3 mm pitch
- RF
- 30 GHz and beyond
Assembly
SMT and through-hole assembly through a qualified US partner facility, with advanced package support, leaded and lead-free lines, AOI, X-ray, and BGA rework.
Process envelope
| Assembly types | SMT and through-hole |
|---|---|
| Smallest component placed | 0201 / 01005 |
| Package support | BGA, µBGA, flip chip |
| Minimum pitch | 0.3 mm, 0.4 mm |
| Substrate types | Rigid, flex, and rigid-flex assemblies |
| Volume range | Prototype and production quantities |
| Turnaround | Same day delivery available |
| Solder paste alloys | SAC305 lead-free and Sn63/Pb37 leaded |
| Cleaning process | Water soluble |
| Inspection | AOI and X-ray |
Equipment
| Solder paste printing | EKRA, DEK |
|---|---|
| Solder paste inspection | Mycronic SPI |
| Placement | Mycronic surface mount pick and place; iineo Europlacer dual turret, max 30,000 cph |
| Reflow | BTU Pyramax, 12 zone; Heller 1809W, 9 zone; Vitronics Soltec XPM2 |
| Wave soldering | NU/ERA, leaded and lead-free |
| Selective soldering | Ersa Smartflow, leaded and lead-free |
| AOI | Mirtec MV-6 and MV-7, 5 high-resolution cameras |
| X-ray | Dage XD7600NT |
| BGA rework | Air-Vac DRS 24C; Chip-off WDS-650 |
| Cleaning | Typhoon T-12 wash system |
Leaded process capability is maintained alongside lead-free, supporting high-reliability builds where tin whisker risk rules out a RoHS process.
Fabrication · partner network
Rigid, flex, rigid-flex, HDI, RF, and mixed-material fabrication routed by geometry, material, schedule, and domestic requirements.
Made in the USA
Under 24 hour turnaround available. Load board, probe card, and test board expertise.
Overseas partners
Prototype to high volume. ISO, UL, and IPC standards certified. India, Vietnam.
The fabrication route for each order is determined and documented in the quote before approval.
Fabrication envelope
Swipe table →
| Specification | Standard | Advanced |
|---|---|---|
| Maximum layer count | 16 | 32 |
| Board thickness | 0.015 to 0.200 in | 0.010 to 0.250 in |
| Trace / space, outer 1 oz | 6/6 mil | 4/4 mil |
| Trace / space, inner 0.5 oz | 5/5 mil | 3/3 mil |
| Minimum mechanical drill | 0.006 in | 0.004 in |
| Minimum laser drill | 0.004 in | 0.003 in |
Board construction
Swipe table →
| Specification | Standard | Advanced |
|---|---|---|
| Minimum layer count | 1 | 1 |
| Outer layer finished copper | 1 oz to 2 oz | 1 oz to 4 oz |
| Inner layer finished copper | 0.5 oz to 2 oz | 0.3 oz to 3 oz |
| Annular ring | 0.005 in | 0.003 in mechanical, 0.001 in laser |
| Aspect ratio, through-hole | 10:1 | 15:1 |
| Plated hole to copper | 0.008 in | 0.005 in |
| Copper to board edge, outer | 0.010 in | 0.005 in |
| Copper to board edge, inner | 0.015 in | 0.005 in |
| Plated and non-plated slots | Routed | Routed or nibbled |
| Minimum panel size | 9 in × 12 in | 8 in × 8 in |
| Maximum panel size | 18 in × 24 in | 24 in × 36 in |
Trace and space by copper weight (mil, trace/space)
Swipe table →
| Layer and copper weight | Standard | Advanced |
|---|---|---|
| Outer, 1 oz | 6/6 | 4/4 |
| Outer, 2 oz | 10/10 | 8/8 |
| Outer, 3 oz | 15/15 | 12/12 |
| Outer, 4 oz | 20/20 | 20/20 |
| Inner, 0.5 oz | 5/5 | 3/3 |
| Inner, 1 oz | 6/6 | 5/5 |
| Inner, 2 oz | 10/10 | 8/8 |
3 mil geometry is available on inner layers at 0.5 oz under the advanced process. Best outer layer geometry is 4 mil at 1 oz.
Board thickness by layer count
Swipe table →
| Layer count | Standard | Advanced |
|---|---|---|
| 1 layer | 0.015 to 0.200 in | 0.010 to 0.250 in |
| 2 layer | 0.015 to 0.200 in | 0.010 to 0.250 in |
| 4 layer | 0.020 to 0.200 in | 0.016 to 0.250 in |
| 6 layer | 0.031 to 0.200 in | 0.025 to 0.250 in |
| 8 layer | 0.047 to 0.200 in | 0.031 to 0.250 in |
| 10 layer | 0.062 to 0.200 in | 0.040 to 0.250 in |
| 12 layer | 0.062 to 0.200 in | 0.050 to 0.250 in |
| 14 layer | 0.075 to 0.200 in | 0.062 to 0.250 in |
Drilling
Swipe table →
| Specification | Standard | Advanced |
|---|---|---|
| Min drill, final thickness up to 0.031 in | 0.006 in | 0.004 in |
| Min drill, 0.031 to 0.062 in | 0.008 in | 0.005 in |
| Min drill, 0.062 to 0.093 in | 0.010 in | 0.006 in |
| Min drill, 0.093 to 0.125 in | 0.015 in | 0.008 in |
| Min laser, dielectric up to 0.004 in | 0.004 in | 0.003 in |
| Largest hole | 0.247 in plated, 0.250 in non-plated | Design specific |
| Nibbling | No | Yes |
| Plating in holes | 0.0008 in | 0.0015 in |
| Back drill for stub removal | Available | Available |
Via technology
Swipe table →
| Capability | Standard | Advanced |
|---|---|---|
| Blind vias | No | Yes |
| Buried vias | No | Yes |
| Stacked vias | No | Yes |
| Controlled depth blind vias | No | Yes, max 0.75:1 aspect ratio |
| Pre-drilled core blind vias | No | Yes |
| Sublamination blind vias | No | Yes |
| Build-up technology | No | Up to 4-N-4, any layer |
| Filled vias | Non-conductive | Non-conductive, conductive, or partial |
| Tented vias | Yes | Yes |
| Soldermask plugged vias | Yes | Yes |
Controlled impedance
| Layers supported | Up to 32 |
|---|---|
| Single-ended tolerance | ±10% std / ±5% adv |
| Differential pair tolerance | ±10% std / ±5% adv |
| TDR testing | Yes |
Silkscreen
| Colors | 7 standard / custom adv |
|---|---|
| Minimum legend width | 0.004 in |
| Silkscreen to pad spacing | 0.005 in std / 0.004 in adv |
Soldermask
Swipe table →
| Specification | Standard | Advanced |
|---|---|---|
| Colors | Green, black, blue, red, white, clear, yellow | Custom |
| Finish | Semi-gloss, matte | Semi-gloss, matte |
| Thickness over copper | 0.0007 in | 0.0010 to 0.0012 in, double coat |
| Web / dam | 0.005 in | 0.003 in |
| Gap to pad | 0.004 in | 0.002 in |
| Copper ring under mask-defined pad | 0.003 in | 0.001 in |
| LPI | Yes | Yes |
| Dry film | No | Yes |
Surface finishes
Laminate and material systems
Swipe table →
| Material class | Suppliers | Designations |
|---|---|---|
| FR-4 and high-Tg FR-4 | Isola, Ventec | IT180, 185HR, 370HR, VT42, VT47 |
| Specialty FR-4 | Isola | IS410, FR408HR |
| RF and high frequency | Rogers | RO4003, RO4350, RO4360, RO4835 |
| PTFE and ceramic-filled | Rogers | RO3003, RO3006, RO3010, RO3210, RO5880, RO6002, RO6006, RO6035 |
| Polyimide | Isola, Arlon | G200, 85N |
| Low-loss digital | Nelco | N4000, N4350, N5000, 4000-13 |
| Very low loss | Panasonic | Megtron 6 |
| Black FR-4 | Ventec | VT42-B |
| Flex core | DuPont, Apexyl | AP series |
| Flex adhesive and coverlay | DuPont, Apexyl | LF/FR series |
Polyimide, Rogers RF and PTFE, and Megtron 6 support airborne and RF defense hardware. Hybrid and mixed-material stackups are supported.
Product types
RF and microwave
| Frequency range | 100 MHz to 30 GHz and beyond |
|---|---|
| Test equipment | 6 network analyzers, combined sweep 50 MHz to 40 GHz |
| Antenna measurement | Custom anechoic boxes |
| Etch control | Close tolerances on critical RF features |
| Stub removal | Back drill |
| Stackups | Multilayer, hybrid, mixed-material |
| RF finishes | ENIG, ENEPIG, hard and soft wire bondable gold, immersion silver |
Design and secondary operations
Layout support, manufacturing outputs, DFM and DFT review, coating, staking, encapsulation, and flying probe.
3.1 / Design capability
- Single and multilayer boards
- Digital, analog, and RF circuits
- High density and fine line SMT, BGA, and through-hole
- Ultra high speed
- EMI suppression
- Design for manufacturing (DFM)
- Design for test (DFT)
- Input: netlist, PADS PowerLogic, AutoCAD, hand-drawn schematics
3.2 / Deliverables
- Layout PCB database
- Gerber files and aperture list
- Drill data
- Fabrication drawings
- Photoplots on request
3.3 / Secondary operations
- Conformal coating
- Staking
- Encapsulation
- Flying probe test
Testing and inspection
AOI and X-ray on every assembly, with functional test, powered bring-up, firmware loading, and fixture work by quote.
Every board is inspected before it ships. Beyond that, you pick the level of testing your program needs, from automated inspection to a full powered bring-up with firmware loaded. The test level for each order is agreed and documented in your quote.
What we run
| Inspection · every board | Automated optical inspection (AOI) and X-ray on every assembly. The inspection record ships with the boards. |
|---|---|
| Functional test | Powered test against your spec or test fixture to confirm the board performs before it leaves. |
| Board bring-up | Full bring-up of the assembled board, from bare hardware to a known-good, running state. |
| Firmware load & flashing | We flash your firmware and confirm the board boots and responds. |
| EMC and emissions | Not included in standard inspection or functional test. Pre-compliance work and certified-lab testing can be coordinated when quoted separately. |
Fixtures and rework
Your acceptance criteria and any customer-supplied fixture are agreed before production. The fixture is available at the assembly and test site before boards leave the line, so a failed board can be diagnosed and reworked before shipment. Custom fixture design can be quoted with the build.
Standing behind the build
When ProvenMetal selects the MPNs, ProvenMetal owns the outcome. If a board fails because of a part we chose or our workmanship, we make it right, rework or rebuild, on us. You are not left holding a dead board over a sourcing call we made.
Parts and sourcing
Turnkey procurement or customer-consigned kits, with ESD and moisture controls and lot-level traceability.
Most orders are turnkey: you send a BOM and we source and verify every part. If you would rather supply your own components, we accept consigned parts too.
Turnkey and consigned
| Turnkey · default | You send the BOM. We source and verify every part to your spec and budget, and buy against your build quantity before assembly starts. |
|---|---|
| Consigned parts | Prefer to supply your own components? Ship them to us and we build with your kit. Every consigned kit is received, counted, and inspected against your BOM before the build. |
Storage and handling
| ESD control | Parts are received, stored, kitted, and assembled in ESD-protected areas. Static-control packaging stays in place through point of use. |
|---|---|
| Moisture sensitivity | MSL labels and floor-life status are tracked through the build. Opened parts are dry-packed or baked when required by the manufacturer and IPC/JEDEC J-STD-033. |
| Lot traceability | Manufacturer, MPN, lot or date code, received quantity, and disposition remain tied to the order's build record. |
| Long-term storage | Stored inventory remains sealed and labeled. Moisture-sensitive material is dry-packed with desiccant and a humidity indicator card. |
Certifications and standards
ProvenMetal registration and partner-held quality, aerospace, medical, security, IPC, UL, and RoHS credentials.
ProvenMetal
Held across our assembly and fab partners
Certificates, registration numbers, and scopes available on request through ProvenMetal.
Send the files. We'll confirm the route.
Upload Gerbers, drill files, BOM, and placement data for a build-specific review, or reach out at founders@provenmetal.com.
Send what you have
- Gerbers or ODB++
- NC drill files
- Bill of materials
- Placement data
- Fabrication drawing
- Test requirements